Participate in design‑for‑test analysis at IC design cycle including testability feedback and test plan definitions.
Responsible for providing wafer/package test solutions per IC’s test requirement, including defining standard/customized test platform architecture, designing wafer probe card / package test board, integrating test hardware and developing associated test methodologies.
Develop, integrate and optimize test programs for IC’s design validation, characterization and manufacturing release.
Work with manufacturing support team in qualifying production test programs with attention to key performance indices including test coverage, test cost and yield.
Conduct root‑cause analysis of early customer returns and develop solutions by improving test coverage in test programs or test hardware.
Collaborate with vendors to build production auto‑test handlers or test fixtures.