• Responsible for sustaining and improving Die Sort operation.
• Responsible for sustaining and improving Chipsales operation.
• Interface with Chipsales customers and improve customer satisfaction.
• Interface with Die Sort subcons and improve subcons technical capability.
• Project leader for die sort strategic projects (automation+capacity ramp). Project leader for global SPC sustainable in Malaysia and in conjunction with other sites.

Requirements:

• Bachelor Degree or equivalent qualification in engineering.
• Min. 5 years experience in semiconductor high volume manufacturing.
• Strong Process technical knowledge with skillsets in Die Sort and project management skills.