We are looking for a Package Design Engineer to join our advanced silicon packaging design and simulation team and contribute to the design and delivery of high‑performance 2.5D/3D, chiplet‑based, FCBGA, SiP, wire bond and QFP/QFN packages used in industry‑leading products. The role requires strong technical depth in package layout execution, manufacturability, and cross‑domain co‑design with silicon, SI/PI, thermal, and reliability teams.

Key Responsibilities

• Perform package layout design and development for advanced packages including 2.5D/3D IC, FCBGA, SiP, and multi‑chip modules.
• Develop and maintain package CAD databases, ensuring accuracy and adherence to design guidelines, Design for Manufacturing (DFM), and Design for Assembly (DFA) requirements to ensure producibility.
• Manage end-to-end design cycle, including schematic creation, netlist import, footprint assignment, and generation of manufacturing o...