ASM Yield and DPM Improvement: Accountable for improving assembly related coverage within the manufacturing flows to improve the Time 0 and Field DPM and reduce/prevent inline fallout within the assembly process.
HBM Cube Yield Improvement: Improving HBM Cube yield through test optimization and coverages by collaboration with Technology Development and Packaging organizations to reduce Manufacturing Line Yield.
Cumulative Yield Ownership: Work with cross‑functional teams to lead impactful initiatives that significantly enhance overall cumulative yield and quality improvement, driving substantial benefits for the organization.
Root Cause and Resolution of Qual and RMA Packaging Issues: Debug and identify root cause and failures in by electric failure analysis (EFA) and Physical Failure Analysis (PFA) and drive for resolution and improvements through cross‑functional team collaboration.