Signal Integrity/ Power Integrity Staff Engineer

Date: Mar 24, 2026

Location: Penang, 07, MY

General Overview

Functional Area: Engineering
Career Stream: Design Engineering Hardware
SAP Short Name: SLE-ENG-DHW
IC/MGR: Individual Contributor
Direct/Indirect Indicator: Indirect

Detailed Description

• PCB material selection and stack-up definition.
• 3D passive channel modeling and electromagnetic extraction.
• Performing signal integrity pre-layout and post-layout analysis.
• Performing static timing and signal integrity analysis of parallel interfaces.
• Designing and analyzing multi-gigabit serial links.
• Performing power integrity analysis on power delivery networks.
• Generating and verifying PCB layout rules and managing constraints for PCB layout.
• Working directly with ASIC and PCB design t...