Are you ready to shape the future of co-packaged optics and high-speed data communication? Join our heterogeneous integration team and drive the development of advanced interposers for next-generation of photonic-electronic systems.
Your future tasks include:
Research and development of co-packaged optics (CPO) and advanced packaging platforms (2.5D and 3D).Leadership and acquisition of industrial and collaborative R&D projectsAdvanced project management and coordination of multidisciplinary project teamsTechnical lead, scientific reporting, publications and dissemination activitiesDevelopment of research proposals and acquisition of funded projectsDesign and fabrication of Si/RDL interposers for photonic-electronic integration. Development of CPO concepts, including optical input/output (I/O) integration, photonic routing and electrical co-design.Process development for TSV fabrication ...