Sandisk is looking for an expert in semiconductor packaging to join their Material Engineering team in Penang, Malaysia. The role involves driving advancements in packaging materials, ensuring compliance with industry standards, and collaborating with various teams to develop solutions for next-generation package requirements.

Candidates should possess a Master’s or PhD in Materials Science and have at least 5 years of relevant experience. Strong skills in material characterization and a solid understanding of packaging systems are essential. A commitment to diversity and an inclusive environment is central to Sandisk's values.