Key Job Accountabilities :

• Lead and manage semiconductor backend manufacturing operations across Backgrind, Laser Mark, , Laser groove, Wafer Saw, AOI, and Tape & Reel processes to achieve safety, quality, delivery, cost, and productivity targets.

• Drive operational excellence through continuous improvement initiatives focused on yield enhancement, cycle time reduction, equipment utilization, and cost optimization.

• Lead multiple production shifts through supervisors and engineers, ensuring effective manpower planning, workforce development, and operational discipline.

• Manage customer escalations, production risks, and quality excursions, ensuring timely containment, root cause analysis, and corrective actions.

• Partner with Process, Equipment, Quality, Planning, and Maintenance teams to resolve complex manufacturing issues and improve process robustness.

• Monitor and drive key manufacturing KPIs including OEE, yiel...