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Senior Advanced Packaging & PDN Architect (2.5D/3D)

Company

Axelera AI

Location

Remote, Remote

Type

Full-time

Axelera AI is seeking a Senior Advanced Packaging & Power Delivery Engineer to shape the architecture of next-generation AI accelerators. This role owns power delivery design across the full stack and collaborates closely with R&D teams. Key responsibilities include leading advanced packaging decisions and ensuring power integrity.

Ideal candidates will have 7+ years of experience in semiconductor packaging and a degree in Electrical Engineering. Axelera AI offers a flexible working arrangement and a competitive compensation package, ensuring a collaborative and innovative team culture.

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