Job Description As a Research Engineer in the Wafer-to-Wafer (W2W) Bonding Module, you will work on Temporary Bonding and Debonding (TBDB) processes—an essential step in advanced semiconductor packaging for handling ultra-thin wafers. This role focuses on process development, optimization, and stabilization to enable next-generation packaging technologies.
Key Responsibilities - Develop and optimize temporary bonding and debonding processes for wafer-level packaging.
- Support integration of process flows, ensuring compatibility across multiple steps in advanced packaging including laser debonding and back grinding.
- Investigate and resolve process issues and defects such as voids, warpage, and delamination.
- Plan and execute Design of Experiments (DOE) for process development.
- Collect, analyze data, and document findings in technical reports.
Job Requirements - Bachelor's degree in Materials...