Perform Root Cause Analysis (RCA): Lead the systematic investigation of MOSFET failures (e.g., electrical overstress (EOS), electrostatic discharge (ESD), gate oxide integrity, latch-up, thermal runaway, etc.) from both internal qualification tests and customer returns.
Utilize Advanced FA Tools: Operate and interpret data from a wide range of failure analysis equipment, including:Electrical characterization (Curve Tracer, Semiconductor Parameter Analyzer)Non-destructive analysis (X-ray, C-SAM, Optical Microscopy)De-processing techniques (Decapsulation, Wet/Delayering, Cross-sectioning)Analytical tools (SEM, EDX, FIB, TEM, OBIRCH, EMMI, TIVA)
Document and Report Findings: Prepare detailed FA reports with clear conclusions, supporting data, and actionable recommendations for corrective actions.
Collaborate Cross-Functionally: Interface with R&D, product engineering, process integration, and quality...