Package Design & Development:Lead the design and development of new MOSFET packages, especially for lead frame based (e.g. DFN).Lead frame and clip frame design experience is preferred.Create detailed package models using 3D CAD software and define all critical dimensions, material stack-ups, and assembly drawings.Optimize package designs for superior electrical performance (low RDS(on), low parasitic inductance/capacitance), thermal performance (low RthJC), and mechanical robustness.
Simulation & Analysis:Perform multi-physics simulations, including thermal (e.g., Ansys Icepak, SolidWorks Simulation), electrical (e.g., Q3D Extractor, HFSS), and mechanical stress analysis to predict and validate package performance.Analyze simulation results to identify design trade-offs and drive design improvements.Correlate simulation models with empirical data from lab characterization to ensure accuracy.