We are seeking a highly experienced Principal Engineer, Package Co-Design Leader with strong experience in Packaging and Die-Package Co-Design. This role requires deep expertise in different packaging technologies, die/package co-design interactions, signal/power integrity, thermal, and mechanical considerations.
Principal Engineer, Package Co-Design


About GlobalFoundries:

GlobalFoundries is a leading full-service semiconductor foundry providing a unique combination of design, development, and fabrication services to some of the world’s most inspired technology companies. With a global manufacturing footprint spanning three continents, GlobalFoundries makes possible the technologies and systems that transform industries and give customers the power to shape their markets. For more information, visit www.gf.com.


Introduction:

We are seeking a highly experienced Principal Engineer, Package Co-Design Leader with strong experience in Pack...