Lead NPI activities for new products from design handoff to production ramp, with focus on assembly and test processes.
Coordinate with OSAT partners to define assembly production plans, including subcontractor scheduling and engineering lot tracking.
Drive test hardware readiness (Load Board, Probe Card, Socket) and test program bring-up at OSAT test floors.
Manage engineering builds at assembly and test subcontractors, collect data (yield, bin distribution, contact yield), and identify early issues.
Perform correlation between ATE test results and lab characterization data to ensure test program accuracy before production release.
Lead first-pass yield (FPY) improvement for NPI advanced package lots and drive root-cause analysis and resolution of process issues related to bumping, flip-chip attach, substrate assembly, underfill, warpage, delamination and ball attach.