Foxconn Industrial Internet (FII) provides innovative design and advanced manufacturing capabilities.
FII centers around Cloud Based Computing, Big Data, High-Speed Networks, Automation, and Industry 4.0 methodology.
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FII is seeking a highly motivated Thermal Mechanical Engineer (or equivalent) with expertise in thermal and fluids engineering to contribute to the cooling of servers.
As a part of the Server R&D team, the Thermal Mechanical Engineers utilize CAD software to address thermal challenges in support of server designs and technical proposals, review design work with customers and collaborate with multi-functional teams to optimize designs, validate design work, and release the products to volume manufacturing.