Our vision is to transform how the world uses information to enrich life for all.

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

Advanced Packaging Technology Development org is seeking an experienced and technically strong Die Design & Layout Manager to lead our die design and layout engineering function in support of our High Bandwidth Memory (HBM) packaging program. This role sits at the critical intersection of silicon design and advanced packaging, responsible for defining and executing die-level design strategy that enables world-class HBM product integration.

You will lead a team of die design and layout engineers, own the die design methodology and sign-off flow, and serve as the primary technical bridge between silicon design, packaging, process integration, and product engineer...