Internship Overview Project Title: NAND Advanced CMOS Metal‑Short Reliability Study and Process Improvement Exploration
Location: 1 North Coast Drive, Singapore
Department: Product Integration Engineering (PIE), Process Integration (PI)
Duration: Minimum 5 months full‑time (Preferred period: July–November 2026)
Project Scope & Responsibilities - Fundamentals of CMOS metallisation processes and process interactions
- Overview of process evaluation changes and their impact on wafer characteristics
- Introduction to Failure Analysis characterisation concepts and fail‑model development approaches
- Familiarisation with Micron in‑house SMAI analytics tools and dashboards
- Learning opportunities to observe cross‑functional collaboration within Process Integration and related engineering teams
Deliverables - Learning documentation summarising reliability fail mechanisms studied...