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IC Packaging Method Engineer (1-Year Contract)

Company

Nexperia

Location

seremban, negeri sembilan

Type

Full-time

Nexperia is looking for an Application Engineer in Seremban, Malaysia. This role focuses on developing packing methods and ensuring product quality throughout the development process according to EIA/IEC Standards.

The ideal candidate will have a degree in Engineering or Materials Science, knowledge of IC package design, and strong problem-solving skills. Experience with Design FMEA and CAD is essential.

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