Join Renesas as a Die Bond & Wire Bond Engineer supporting semiconductor assembly from development to mass production in a dynamic team.

Your role

Here’s what you will be doing:

• Support the development, optimization, and maintenance of die bond and wire bond processes to ensure quality, yield, and reliability
• Assist in troubleshooting process issues and perform root cause analysis for defects, yield loss, or equipment problems
• Participate in new product introduction (NPI), process qualification, and transition to mass production
• Help establish and update process parameters, work instructions, and control plans
• Analyze process data using statistical tools such as SPC, CPK, and trend analysis
• Collaborate with cross-functional teams including Production, Quality, Equipment, and R&D
• Contribute to continuous improvement initiatives to enhance yield, cost efficiency, cycle time, and product reliability