We are looking for a skilled NPI Engineer (Assembly Packaging) to join our External Manufacturing team to drive our growing NPI/ NPD portfolio in China, especially new tactical engagements critical for onsemi's business growth. Key focus will be wafer-level packaging (WLP), bumping and post-foundry solutions. In this role, you will leverage your strong expertise and extensive technical network to drive new production introduction, develop new capability requirements, shape manufacturing strategies, and deliver advanced solutions for next-generation silicon technology and WLP solutions.