Our client operates in the Telecoms Equipment Semiconductors Industry, with its headquarters rooted strongly in the United States. It has branches spread to more than 30 countries, providing employment to more than 45,000 people all over the world. They fall in the Fortune 500 Companies. Their core business is designing and manufacturing semiconductors. They believe in driving digital transformation.

• Leading and/ or co-working with global process cluster on the development of next generation lithography for microacoustics filter and wafer-level packaging from concept to qualification and manufacturing release.
• Defining process requirements, success criteria, design of experiments (DOE), and characterization plans.
• Driving root cause analyses, failure mechanism studies, and improvement loops to achieve performance,...