Responsibilities

• Develop, qualify, and optimize Die Attach and Flip Chip assembly processes for semiconductor packaging.
• Provide process engineering support for production lines, including troubleshooting yield and quality issues.
• Perform process characterization, DOE (Design of Experiments), and process optimization to improve performance and reliability.
• Support new product introduction (NPI) and process transfer from development to high-volume manufacturing.
• Work closely with equipment, materials, and product engineering teams to resolve process-related issues.
• Establish and maintain process documentation, specifications, and control plans.
• Drive continuous improvement initiatives to enhance yield, productivity, and cycle time.
• Analyze failure modes and reliability concerns related to die attach and flip chip processes.
• Interface with equipment vendors and material suppliers to qual...