Job Description This role is fully hands-on and includes, but no limited to the following responsibilities: Lead the setup and buy-off of new processes and machines. Perform process setup, buy-off and execution of characterization activities, including DOE, prototype, qualification and mass production build. Trouble shoot and resolve machine-related issues to ensure smooth operations problem. Perform data collection, analysis and consolidation to support engineering activities. Requirement Minimum Diploma in Material Science, Applied Physics, Mechanical Engineering or related discipline. Experience in high volume electronics manufacturing environment preferably semiconductor assembly. Must be familiar and have hands-on experience with either one of the following process and machines, (i) SMT/ Flux Clean, (ii) Flip Chip/ TCB, (iii) Underfill, (iv) Lid Attach/ Laser Mark, (v) Ball Mount/ AOI. Familiar with JMP data analysis capability. Knowledge and experience on multiple process of the ...